SiEngine Technology

Summary active Updated Aug 5, 2026

This profile is AI-generated. If you spot an error, please help us fix it by sharing a URL to the correct information.

Location Shanghai, China
Founded 2018
Latest Stage Equity Financing
Total Raised $200M+ (2026 round)

About

SiEngine Technology is a Shanghai-based automotive semiconductor designer originally incubated by ECARX Holdings and co-founded in 2018 as a joint venture between ECARX and Arm China 123. The company has since evolved into an independent enterprise, with ECARX retaining its position as SiEngine’s largest single shareholder 123. On 2026-07-31, SiEngine announced it had secured US$200 million in new equity capital from institutional investors over the first half of 2026, positioning it among China’s top vehicle-grade semiconductor designers 123. The company’s most recent product, the 5nm Longying II cabin-driving fusion SoC, integrates native large-language-model functionality and is purpose-built for ECARX’s next-generation Antora central computing platforms and Flyme Auto OS 13.

Disclaimer: This is a lean profile built from initial round coverage and may be expanded as more information becomes available.

Funding History

Date Round Amount Lead Co-investors
2026-07-31 Equity Financing $200M Institutional investors (undisclosed) 123

Proceeds will fund next-phase R&D, production capacity expansion, globalization, and international customer growth, strengthening ECARX’s vertical silicon-to-software competitive moat 13.

What Investors Say

No independently sourced investor commentary beyond press-release attribution at this time.

What Founders Say

No independently sourced founder testimonials found at time of profile creation.

Sources


  1. “ECARX-Backed Chip Maker SiEngine Secures US$200M Equity Financing to Accelerate Vertical Silicon-to-Software SDV Innovation,” PR Newswire, July 31, 2026. Accessed August 2026. https://www.prnewswire.com/news-releases/ecarx-backed-chip-maker-siengine-secures-us200m-equity-financing-to-accelerate-vertical-silicon-to-software-sdv-innovation-302839948.html

  2. “SiEngine Secures $200 Million Equity Financing To Accelerate Vertical Silicon-To-Software SDV Innovation,” Pulse 2.0, July 31, 2026. Accessed August 2026. https://pulse2.com/siengine-secures-200-million-equity-financing-to-accelerate-vertical-silicon-to-software-sdv-innovation/

  3. “ECARX SiEngine Secures $200M Equity Financing,” StockTitan, July 31, 2026. Accessed August 2026. https://www.stocktitan.net/news/ECX/ecarx-backed-chip-maker-si-engine-secures-us-200m-equity-financing-415lxthd35w1.html